SO-DIMMs / SWISSBIT
| Embedded applications place the highest demands on storage modules. Our newest manufacturer SWISSBIT rises to the challenges: | ||
| | SWISSBIT sees itself as an expert in the field of miniaturisation while simultaneously increasing storage capacity. In Berlin they turn many years of experience into top products. More than 15 years of Chip on Board (COB) experience and the patent for stacking chips with centre pads set the company apart. | |
| With this know-how and state-of-the-art testing equipment, SWISSBIT is now supplying a whole series of SO-DIMMs for embedded applications. Long before the first modules based on µBGA housings, SWISSBIT had recognised the needs of industry. Smaller and above all thinner modules that can be easily used everywhere and guarantee optimum air circulation across the board. In this case the chips are not located in a housing, instead an epoxy resin cover protects the components from possible environmental influences. | ||
| This coating also has low thermal resistance, around 75% lower than with TSOP housings, which ensures rapid and effective dissipation of arising heat. On the basis of these properties SWISSBIT offers the entire SO-DIMM portfolio up to the industrial temperature range of -40°C to +85°C. This allows the modules to be used even in the tough conditions of some industrial and automation systems. |
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| With a standard thickness of 3.8 mm it still fully meets the JEDEC standard. Modern measuring and testing systems guarantee the quality of the SO-DIMMs. All storage modules are 100 per cent stressed in the burn-in system and then tested for their static and dynamic electrical properties at various temperatures. Professional design-in support rounds off the programme. | ||
| You can get further information on the products, | ||
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